Document Detail


Uncertainty improvement of geometrical thickness and refractive index measurement of a silicon wafer using a femtosecond pulse laser.
MedLine Citation:
PMID:  22714206     Owner:  NLM     Status:  In-Data-Review    
Abstract/OtherAbstract:
We have proposed a modified method to improve the measurement uncertainty of the geometrical thickness and refractive index of a silicon wafer. Because measurement resolution based on Fourier domain analysis depends on the spectral bandwidth of a light source directly, a femtosecond pulse laser having the broad spectral bandwidth of about 100 nm was adopted as a new light source. A phase detection algorithm in Fourier domain was also modified to minimize the effect related to environmental disturbance. Since the wide spectral bandwidth may cause a dispersion effect in the optical parts of the proposed interferometer, it was considered carefully through numerical simulations. In conclusion, the measurement uncertainty of geometrical thickness was estimated to be 48 nm for a double-polished silicon wafer having the geometrical thickness of 320.7 μm, which was an improvement of about 20 times that obtained by the previous method.
Authors:
Saerom Maeng; Jungjae Park; Byungsung O; Jonghan Jin
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Publication Detail:
Type:  Journal Article    
Journal Detail:
Title:  Optics express     Volume:  20     ISSN:  1094-4087     ISO Abbreviation:  Opt Express     Publication Date:  2012 May 
Date Detail:
Created Date:  2012-06-20     Completed Date:  -     Revised Date:  -    
Medline Journal Info:
Nlm Unique ID:  101137103     Medline TA:  Opt Express     Country:  United States    
Other Details:
Languages:  eng     Pagination:  12184-90     Citation Subset:  IM    
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