Document Detail


Influence of ligand structure on the stability and oxidation of copper nanoparticles.
MedLine Citation:
PMID:  17961585     Owner:  NLM     Status:  PubMed-not-MEDLINE    
Abstract/OtherAbstract:
The stability and oxidation of copper nanoparticles stabilized with various ligands have been studied. Lauric acid-capped copper nanoparticles were prepared by a modified Brust-Schiffrin method. Then, ligand exchange with an excess of different capping agents was performed. Oxidation and stability were studied by UV-vis, XRD, and TEM. Alkanethiols and oleic acid were found to improve air stability. The oxidation resistance of thiol-capped copper nanoparticles was found to increase with the chain length of the thiol. However, excess thiol caused etching of the particles under nitrogen. With oleic acid no etching was observed under nitrogen. After oxidation, no traces of the ligand-exchanged particles were found, suggesting their dissolution due to excess ligand. Oleic acid protected the particles against oxidation better than the tested thiols at large excess (ligand-copper ratio 20:1).
Authors:
Petri Kanninen; Christoffer Johans; Juha Merta; Kyösti Kontturi
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Publication Detail:
Type:  Journal Article     Date:  2007-10-24
Journal Detail:
Title:  Journal of colloid and interface science     Volume:  318     ISSN:  0021-9797     ISO Abbreviation:  J Colloid Interface Sci     Publication Date:  2008 Feb 
Date Detail:
Created Date:  2007-11-26     Completed Date:  2008-02-05     Revised Date:  2009-11-11    
Medline Journal Info:
Nlm Unique ID:  0043125     Medline TA:  J Colloid Interface Sci     Country:  United States    
Other Details:
Languages:  eng     Pagination:  88-95     Citation Subset:  -    
Affiliation:
Helsinki University of Technology, Laboratory of Physical Chemistry and Electrochemistry, P.O. Box 6100, 02015 TKK, Finland.
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