Document Detail

Flip-chip optical couplers with scalable I/O count for silicon photonics.
MedLine Citation:
PMID:  23842395     Owner:  NLM     Status:  In-Data-Review    
A scalable and tolerant optical interfacing method based on flip-chip bonding is developed for silicon photonics packaging. Bidirectional optical couplers between multiple silicon-on-insulator waveguides and single-mode polymer waveguides are designed and fabricated. Successful operation is verified experimentally in the 1530-1570 nm spectral window. At the wavelength of 1570 nm, the coupling loss is as low as 0.8 dB for both polarization states and the planar misalignment loss is less than 0.6 dB for TE and 0.3 dB for TM polarization in a lateral silicon-polymer waveguide offset range of ± 2 µm. The coupling loss does not exhibit any temperature dependence up to the highest measurement point of 70°C.
Ibrahim Murat Soganci; Antonio La Porta; Bert Jan Offrein
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Publication Detail:
Type:  Journal Article    
Journal Detail:
Title:  Optics express     Volume:  21     ISSN:  1094-4087     ISO Abbreviation:  Opt Express     Publication Date:  2013 Jul 
Date Detail:
Created Date:  2013-07-11     Completed Date:  -     Revised Date:  -    
Medline Journal Info:
Nlm Unique ID:  101137103     Medline TA:  Opt Express     Country:  United States    
Other Details:
Languages:  eng     Pagination:  16075-85     Citation Subset:  IM    
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