| Electrodeposition of Copper on Pt(111) Electrode in Sulfuric Acid Containing Polyethylene Glycol and Chloride Ions Probed by In Situ STM. | |
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MedLine Citation:
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PMID: 22676369 Owner: NLM Status: Publisher |
Abstract/OtherAbstract:
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This study employed real-time in situ STM imaging to examine the adsorption of PEG molecules on Pt(111) modified by a monolayer of copper adatoms and the subsequent bulk Cu deposition in 0.1 M H2SO4 + 1 mM CuSO4+ 1 mM KCl + 88 M PEG. At the end of Cu underpotential deposition (~0.3 V vs. Ag/AgCl), a highly ordered Pt(111) - (3 7) - Cu + HSO4- structure was observed in 1 M H2SO4 + 1 mM CuSO4. This adlattice restructured upon the introduction of polyethylene glycol (PEG, molecular weight 200) and chloride anions. At the onset potential for bulk Cu deposition (~0 V), a Pt(111) - (3 3)R30 - Cu + Cl- structure was imaged with a tunneling current of 0.5 nA and a bias voltage of 100 mV. Lowering the tunneling current to 0.2 nA yielded a (4 4) structure, presumably due to adsorbed PEG200 molecules. The subsequent nucleation and deposition processes of Cu in solution containing PEG and Cl- were examined, revealing nucleation of 2-3 nm wide CuCl clusters on an atomically smooth Pt(111) surface at overpotentials less than 50 mV. With larger overpotential ( > 100 mV), Cu deposition seemed to bypass the production of CuCl species, leading to layered Cu deposition, starting preferentially at step defects, followed by lateral growth to cover the entire Pt electrode surface. These processes were observed with both PEG200 and 4000, although the former tended to produce more CuCl nanoclusters. Raising [H2SO4] to 1 M substantiate the suppressing effect of PEG on Cu deposition. This STM study provided atomic or molecular level insight of the effect of PEG additives on the deposition of Cu. |
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Authors:
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Yunlin Fu; Te Pao; Sihzih Chen; Shuehlin Yau; Wei-Ping Dow; Yuh-Lang Lee |
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Publication Detail:
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Type: JOURNAL ARTICLE Date: 2012-6-7 |
Journal Detail:
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Title: Langmuir : the ACS journal of surfaces and colloids Volume: - ISSN: 1520-5827 ISO Abbreviation: - Publication Date: 2012 Jun |
Date Detail:
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Created Date: 2012-6-8 Completed Date: - Revised Date: - |
Medline Journal Info:
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Nlm Unique ID: 9882736 Medline TA: Langmuir Country: - |
Other Details:
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Languages: ENG Pagination: - Citation Subset: - |
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From MEDLINE®/PubMed®, a database of the U.S. National Library of Medicine
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